Intel Corporation has announced several new and enhanced technologies, bolstering its leadership in high performance computing (HPC). The new technologies include the future generation Intel Xeon Phi Processor, called Knights Hill, and Intel Omni-Path architecture, a new high speed interconnect technology optimized for High Performance Computing deployments.
Intel also announced new software releases and collaborative efforts designed to make it easier to extract the full performance potential from current and future Intel Industry- standard hardware.
This new innovation will help to address the dual challenges of extreme scalability and mainstream use of high performance computing systems while providing the foundation for a cost-effective path to superb computing.
The new Intel Xeon Phi Product family, Knights Hill, will be built using Intel’s 10mm process technology and integrate Intel Omni- Path Fabric technology. Industry investment in Intel Xeon Phi processors continues to grow with more than 50 providers expected to offer systems built using the new processor version of Knights Landing with many more systems using the coprocessor PCle card version of the product.
Intel equally disclosed that the Intel Omni-Path Architecture is expected to offer 100 Gbps line speed and up to 56 percent lower switch fabric latency in medium-to-large clusters than InfiniBand alternatives. The Intel Omni-Path Architecture will use a 48 port switch chip to deliver greater port density and system scaling compared to the current 36 port InfiniBand alternatives. Providing up to 33 percent more nodes per switch chip is expected to reduce the number of switches required, simplifying system design and reducing infrastructure costs at every scale.
Charles Wuischpard, Vice President, Data Center Group, and General Manager of Workstations and High Performance Computing at Intel says “Intel is excited about the strong market momentum and customer investment in the development of High Performance Computing systems based on current and future Intel Xeon Phi processors and high-speed fabric technology. The integration of these fundamental HPC building blocks, combined with an open standards-based programming model, will maximize HPC system performance, broaden accessibility and use, and serve as the on-ramp to exascale.”
The expected benefits of the system scale include up to 1.3x greater port density than InfiniBand – enabling smaller clusters to maximize single switch investments. Use up to 50 percent fewer switches than a comparable InfiniBand-based cluster of medium- to large-size and up to 2.3x higher scaling in a two-tier fabric configuration using the same number of switches as an InfiniBand-based cluster – allowing for more cost-effective scaling for very large cluster-based systems.
Intel also announced new software releases and collaborative efforts designed to make it easier to extract the full performance potential from current and future Intel Industry- standard hardware.
This new innovation will help to address the dual challenges of extreme scalability and mainstream use of high performance computing systems while providing the foundation for a cost-effective path to superb computing.
The new Intel Xeon Phi Product family, Knights Hill, will be built using Intel’s 10mm process technology and integrate Intel Omni- Path Fabric technology. Industry investment in Intel Xeon Phi processors continues to grow with more than 50 providers expected to offer systems built using the new processor version of Knights Landing with many more systems using the coprocessor PCle card version of the product.
Intel equally disclosed that the Intel Omni-Path Architecture is expected to offer 100 Gbps line speed and up to 56 percent lower switch fabric latency in medium-to-large clusters than InfiniBand alternatives. The Intel Omni-Path Architecture will use a 48 port switch chip to deliver greater port density and system scaling compared to the current 36 port InfiniBand alternatives. Providing up to 33 percent more nodes per switch chip is expected to reduce the number of switches required, simplifying system design and reducing infrastructure costs at every scale.
Charles Wuischpard, Vice President, Data Center Group, and General Manager of Workstations and High Performance Computing at Intel says “Intel is excited about the strong market momentum and customer investment in the development of High Performance Computing systems based on current and future Intel Xeon Phi processors and high-speed fabric technology. The integration of these fundamental HPC building blocks, combined with an open standards-based programming model, will maximize HPC system performance, broaden accessibility and use, and serve as the on-ramp to exascale.”
The expected benefits of the system scale include up to 1.3x greater port density than InfiniBand – enabling smaller clusters to maximize single switch investments. Use up to 50 percent fewer switches than a comparable InfiniBand-based cluster of medium- to large-size and up to 2.3x higher scaling in a two-tier fabric configuration using the same number of switches as an InfiniBand-based cluster – allowing for more cost-effective scaling for very large cluster-based systems.
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